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Dr. Hua Lu

Hua Lu
BSc, MASc, PhD
416-979-5000 ext. 556427

Areas of Academic Interest

Experimental solid mechanics

Microelectronic packaging mechanics and reliability


Year University Degree
1989 Stony Brook University PhD
1982 Tianjin University MSc
1968 Tianjin University BSc

Selected Courses

Course Code Course
MEC 311 Dynamics
MEC 430 Solid Mechanics I
ME8100 Advanced Experimental Stress Analysis
  • Lu, H., Shirazi, A., and Varvani-Farahani, A. “An Inverse Method for a Full Characterization of Thermal-mechanical Performance of Thin Tri-layer Plates.” Journal of Experimental Mechanics, vol. 26, no. 5, 2011, pp. 540-555.
  • Shirazi, A., Lu, H., and Varvani-Farahani, A. “A Hybrid Inverse Method for Evaluating FC-PBGA Material Response to Thermal Cycles.” Journal of Material Science: Material of Electronics, vol. 21, no. 7, 2010, pp. 737–749.
  • Lu, H., Sun, C., Zhou, M., and Shirazi, A. “Recent Applications of Optical and Computer-Vision Methods to Research for Microelectronics Assembly Reliability.” Optics and Lasers in Engineering, vol. 48, no. 11, 2010, pp. 1046-1057.
  • Lu, H., Hussain, R., Zhou, M., Gu, X. “Fiber Bragg Grating Sensors for Failure Detection of Flip Chip Ball Grid Array in Four-Point Bend Test.” IEEE Sensors Journal, vol. 9, no. 4, 2009, pp. 457-463.
  • Laboratory for Experimental Mechanics Research
  • Surface Mounting Technology Association (SMTA) International